Silicon strain gauges with a high gauge factor

The advancement of 3D silicon structuring technologies has paved the way for the manufacture of cost effective and miniaturized strain gauges. Silicon strain gauges offer definite advantages compared to classical strain gauges, e.g., a gauge factor which is 40 times higher.
 
Force sensors based on silicon strain gauges can be applied in weighing technology as well as in the bio and medical technology sectors.
 
The long-term stable and optimized force transfer assembly of the silicon strain gauges onto the measuring body is a decisive requirement. Also critical for success is the adjustment of all technological steps to the dimensions of the strain gauges of only a few micrometer thickness. This includes chip dicing technologies as well as new techniques for handling and mounting the strain gauges onto the measuring body as well as the electrical bonding.  It is crucial to transfer the force to the silicon strain gauges without coupling losses and independent of external influences. To achieve this, the joining point at the chip and measuring body first has to be adapted mechanically.
 
Furthermore, the bonding material has to provide long-term stability and inert behavior towards ambient conditions, requirements which conventional materials such as adhesives do not meet. Here, CiS Forschungsinstitut für Mikrosensorik in Erfurt plans to break new ground in the development of innovative glass solders and optimized epoxy materials.
 
Contact: Uta Neuhaus, CiS Forschungsinstitut für Mikrosensorik GmbH
info@cismst.de