Fraunhofer Institute for Reliability and Microintegration

COMPAMED 2019

Hall 8a, booth H23.5

Fraunhofer IZM works on advanced integration techniques for innovative medical devices. Applications range from ultraminiaturized implants, cardiovascular diagnotic catheters to wearables for multisensor monitoring. The reasearchers uses high end processes like flex circuit integration, stretchable electronics and wafer level high density integration to enable next generation medical electronics. Sensors and wireless interfaces complement these technologies. Risk analysis and biocompatibility assessment ensure compliance with the MDR.

The Fraunhofer Institute for Reliability and Microintegration focuses on microsystem integration, heterosystems, micromechatronics, reliability, wafer level packaging, micro assembly technologies

Products

service provider for microsystems

Services

R&D service, process transfers, reliability evaluations, failure analysis, prototype development, system integration concepts

General Information

Fraunhofer Institute for Reliability and Microintegration
IVAM member
Gustav-Meyer-Allee 25
13355 Berlin
Germany
Number of Employees: 300
Founding Year: 1994
Turnover: N/A

Contact

Erik Jung
+49 30 4640 323 0

Next Events

Meet Fraunhofer Institute for Reliability and Microintegration at:
11.11.2024 - 14.11.2024

COMPAMED 2024

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