Finetech GmbH & Co. KG

Medical Manufacturing Asia 2016

Expo Hall E booth 2M19

Finetech is a developer and manufacturer of innovative equipment solutions for a variety of micro assembly applications. Due to their modular architecture, the manual, semi-automated and full-automatic systems offer maximum process flexibility. Typical fields of use range from R&D and prototyping (high accuracy, low volume) to fully-automated production environments with high yield. Customers include a broad range of industries, such as aerospace, medical technologies, consumer electronics, semiconductor, opto-electronics, defense, universities and research centers. Finetech co-operates closely with all kinds of companies, ranging from small start-ups to multinational corporations.

Products

Die Bonders for Production:

• FineXT 6003: Automatic Multi-chip, Multi-placement Die Bonder
• FineXT 5205: Automated Flexible Bonding Platform for R&D and Production
• FINEPLACER® femto 2: Prototype2Production Bonder

Die Bonders for Research & Development

• FINEPLACER® pico ma: Multi-purpose Die Bonder
• FINEPLACER® lambda: Flexible Sub-Micron Die Bonder
• FINEPLACER® sigma: Advanced Sub-Micron Die Bonding Platform

Available bonding technologies are:

• Thermocompression bonding
• Thermo- / ultrasonic bonding
• Soldering (AuSn / eutectic, Indium, C4)
• Adhesive technologies
• ACF/ ACP bonding
• UV / thermal curing
• Micro mechanical assembly
• Cu/Cu bonding
• Laser soldering
• Vacuum soldering
• Sintering

Typical applications include:

• Wafer level packaging (FOWLP, W2W, C2W)
• 2.5D and 3D IC packaging (TSV)
• Multi chip packaging (MCM, MCP)
• Flip chip bonding (face down)
• Precision die bonding (face up)
• Optical package assembly
• MEMS/MOEMS packaging
• Sensor assembly, bump bonding
• Glass-on-glass, chip-on-glass, chip-on-flex

As of: October 2018

Services

• Systems for micro assembly
• Customized and application-specific equipment solutions
• Application tests
• Technology consultation