300 mm mask aligner for 3D packaging

At Semicon West 2008, SÜSS MicroTec unveiled the second generation of its MA300 Production Mask Aligner, featuring an alignment kit for creating 3D interconnects for applications like chip stacking and 3D image sensor packaging. High alignment accuracy is required to enable 3D applications ranging from latest-generation mobile consumer electronics to supercomputers.

The new 3D alignment platform enables bottom-side and infrared alignment for 300 mm-based, three-dimensional packaging lithography applications, thereby enabling cost-effective mask aligner systems to meet aggressive technology roadmaps for thick resist applications and keep costs low relative to 1X Stepper lithography solutions.

While bottom-side alignment enables to process double-sided structured wafers, the infrared alignment option allows the handling of opaque, yet IR-transparent materials such as adhesives, in particular for thin wafer handling or encapsulation applications. Both alignment techniques have become important for 3D interconnect applications such as etch masks for Through Silicon Vias and dicing streets, backside redistribution layers (RDLs) or bumping applications.

SÜSS MicroTec AG
Brigitte Wehrmann
brigitte.wehrmann@suss.com
www.suss.com