3D circuit carriers for effective miniaturization

MID (Mechatronic Integrated Devices) technology is a specialty of 2E mechatronic. The goal is the miniaturization of microsystems technology components and systems as well as the functional integration while reducing the number of parts.
 
The currently most widely used method is Laser Direct Structuring. LDS describes the method by which it is possible to produce layout structures on three-dimensional injection-molded plastic parts that are turned into 3D circuit boards in further process steps. The LDS method relies on plastics with a special doping of metal nuclei, which releases the laser during the patterning so that the metal atoms can dock in the subsequent metallization process. 2E also offers the rapid production of functional models from original materials using near-series processes. Corrections in the layout can be easily accomplished by changes in the software if necessary.
 
The most popular LDS-MID application is the smart phone antenna. There are also many MID applications used in the automotive industry today. For example, 2E manufactures a sensor solution in large numbers which is used for position sensing with radar systems in cars and trucks. The complete production chain at 2E complies with the high quality standard of the automotive industry.
 
Other exciting applications can be found in the new development and the redesign of medical or industrial products. Examples developed and manufactured by 2E are LED lighting elements or a miniaturized thermal flow sensor. As part of the BMBF-funded research project MELAM 3D a demo module has been developed that demonstrates the possibilities of LDS-MID technology. This module can be obtained free of charge from 2E.

Contact: 2E mechatronic GmbH & Co. KG, info@2e-mechatronic.de