New solution for laser soldering

Häcker Automation GmbH extends its portfolio with a device for selective soldering. The extension module can be used in sophisticated micro assembling processes, which require utmost accuracy for fixating SMT parts on substrates, interconnect devices and circuit boards. Because of outstanding precision performance a laser-based system has been chosen. Thus, spots with a diameter of approx. 0.3 mm can be realised. The diode-based laser head uses a wave length of 960 nm (infrared spectrum) and supplies 25 W of continuous power. The laser class 4 device has a positioning accuracy of ±1 µm.

With the release of the standardized extension module for laser soldering Häcker Automation extends the functionality range, which can be used to build customized micro assembly systems configured according to requirements given by the target process. Due to the modular design concept used by Häcker Automation for machine and device manufacturing the laser soldering head is easily combinable with other extension modules. For instance the device can be mounted together with a dispensing head or a placing head at the Z-axis of the 3-axles portal of the VICO 520 standard machine.  

Kontakt: Alexander Grunert, Häcker Automation GmbH
alexander.grunert@haecker-automation.com