Expanded product portfolio to adress fast-growing HB-LED market: New mask aligner from EVG delivers significantly increased throughput and yield

EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the semiconductor, micro and nanotechnology markets, broadens its portfolio of products dedicated for the manufacture of high-brightness light-emitting diodes with the launch of the new EVG620HBL fully automated mask alignment system. The system builds on EVG’s field-proven mask aligner platform, adding a high-intensity ultraviolet (UV) light source and five cassette stations – significantly more than competitive offerings – to deliver unparalleled throughput and yield. Another key feature of the EVG620HBL is the availability of special recipe-controlled microscopes whose illumination spectrum is optimized to ensure the best pattern contrast with advanced wafer and substrate materials commonplace in HB-LED production.

According to market research firm Global Information, Inc. (Farmington, USA), global consumption of HB-LEDs will continue to grow at a rapid pace over the next decade, from $10 billion in 2010 to $46 billion in 2020. Key drivers will include explosive growth in backlighting applications both in PCs and televisions, and increasingly in general lighting applications in the automotive sector as well as in household and street lighting. To meet this increased demand, HB-LED manufacturers increasingly rely on automated manufacturing solutions.

As with its dedicated EVG560HBL automated wafer-bonding system, introduced last year, EVG developed the EVG620HBL aligner to address these needs. EVG is not new to this market – its bonders and mask aligners are being deployed by four of the top five major HB-LED manufacturers.

Contact: Lisa Kinz, EV Group
L.Kinz@EVGroup.com